The design specification called for the complete encapsulation of the unusually large printed circuit boards (front and back, leaving no part exposed), paying particular attention not only to environmental concerns but also to the optical properties needed for the light sensors (‘incoming’ light) and also the LEDs (‘projected’ light). The encapsulation process developed by us for this unique application required precise control over the volume and uniform thickness of the encapsulation resin.
Various materials and techniques may be applied for any given application but in this specific case a clear epoxy resin solution was chosen (instead of, for example, silicon or polyurethane options) partly due to consideration for the UV stability of the encapsulation medium; it was important to avoid yellowing over time for optical and aesthetic reasons.
The process required us to manufacture custom, polished aluminium mould tools with curing of the previously de-gassed resin happening in a controlled environment for optimum resulting characteristics; these should be no allowable inclusions, particles or bubbles etc. in the finished article. For specific reasons a dry release agent was utilised to enable separation of the product from the mould tools after curing.
Further information on this work of art can be found at www.jasonbruges.com/art/#/back-to-front/